FIB Mill Controller

Purpose

The FIB Mill Controller skill provides focused ion beam process control for site-specific nanofabrication and sample preparation, enabling precise material removal and deposition at the nanoscale.

Capabilities

• TEM lamella preparation
• Nanoscale milling and deposition
• Pattern writing and editing
• Cross-section imaging
• Gas-assisted etching/deposition
• Damage minimization protocols

Usage Guidelines

FIB Processing

1. TEM Lamella Preparation

   • Deposit protective cap
   • Rough mill with high current
   • Fine polish to target thickness

2. Nanofabrication

   • Define pattern geometry
   • Optimize beam parameters
   • Minimize gallium implantation

3. Circuit Editing

   • Navigate to target location
   • Selective material removal
   • Metal deposition for reconnection

Process Integration

• Nanodevice Integration Process Flow
• Multi-Modal Nanomaterial Characterization Pipeline

Input Schema

{
  "operation": "lamella|milling|deposition|cross_section",
  "material": "string",
  "target_thickness": "number (nm, for lamella)",
  "pattern_file": "string (for milling)",
  "beam_voltage": "number (kV)"
}

Output Schema

{
  "process_parameters": {
    "beam_current": "number (pA)",
    "dwell_time": "number (us)",
    "overlap": "number (%)"
  },
  "milling_depth": "number (nm)",
  "lamella_thickness": "number (nm)",
  "damage_layer": "number (nm)",
  "processing_time": "number (minutes)"
}